Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain.
Semiconductor Packaging News Index
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. ...
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News
Qualcomm's interest in Intel cools Qualcomm has paused its interest in acquiring Intel due to financial, regulatory, and operational complexities, including Intel's $50 billion debt and unprofitable semiconductor unit.
Advanced Packaging: The Intensifying Strategic Game
The semiconductor industry is advancing with cutting-edge packaging technologies like 2.5D/3D, Chiplet, and FOWLP, delivering superior performance and integration. These innovations address AI, 5G, and HPC demands, reshaping competition and fueling rapid technological progress ...
The Top 10 Semiconductor Stories of 2024
Readers are captivated by advances in semiconductor tech, from millimeter-scale laser chips slicing steel to TSMC’s bold plan for GPUs with 1 trillion transistors. Highlighting 2023’s breakthroughs, the focus remains on packing immense power into tiny spaces ...
Chip Industry Week in Review
Lawrence Livermore Lab is advancing EUV and plasma particle R&D, aiming for a tenfold increase in EUV laser power with solid-state thulium-doped lasers. DOE funds $179M for microelectronics research, while AI data centers face power distortion risks, per Bloomberg ...
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...
Catching Up on The Latest in Advanced Packaging at SEMICON …
Luc Van den hove from Imec highlighted advanced packaging's vital role in semiconductor innovation at SEMICON Europa 2024. Industry experts showcased breakthroughs in AI power challenges, hybrid bonding for 3D interconnects, and scalable panel-level packaging solutions ...
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027 ...