Aixtron SE, Fraunhofer IISB and Bimanu Cloud Solutions are cooperating in a €28.4 million project called 'Increasing Energy ...

TrendForce says that TSMC plans to repurpose its Hsinchu Fab 5, which handles GaN production, for advanced packaging.

The first results have been reported on a collaboration between ETH Zürich and Australia's Nuclear Science and Technology Organisation (ANSTO), looking at the impact of radiation on SiC devices for ...

Infineon has announced that its scalable GaN manufacturing on 300mm wafers is on track, with first samples available for ...

Navitas' GaN IC portfolio is expected to use Powerchip’s 200mm in Fab 8B, located in Zhunan Science Park, Taiwan. The fab has ...

SiC chipmaker files for Chapter 11 as next step in restructuring agreement SiC chipmaker Wolfspeed has filed for Chapter 11 ...

Renesas Electronics has introduced three new 650V GaN FETs for AI data centres and server power supply systems including the ...

Pragmatic Semiconductor, a UK-based pioneer in flexible IGZO semiconductor technology, has appointed John Quigley as ...

While CMOS may be synonymous with the manufacture of silicon ICs, it’s a versatile process can also be applied to the ...

Migrating to the unlicensed visible light spectrum, which spans 400 THz to 800 THz, accesses a vast bandwidth, enabling VLC ...

Underpinning all this progress is the work of Hiroshi Amano and his colleagues, who made a pivotal breakthrough in GaN ...

EV Group (EVG), a provider of semiconductor integration and process solutions, has topped the rankings in the 2025 ...