Regionally, the Americas remained the largest market, with revenue up 12.2% year-over-year, followed by Europe, the Middle East and Africa (EMEA) with an 11.4% rise. Asia Pacific posted a 6.7% ...
December 13, 2013. The ContourSP large-panel metrology system more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multichip modules (MCM) over previous ...
TL;DR: NVIDIA is exploring CoWoP PCB packaging for its next-gen Rubin R150 AI GPUs, offering improved signal and power integrity, enhanced thermals, and reduced costs by eliminating the package lid.
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...
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