Compared to the second quarter of 2025, third quarter results represented a 6.0% increase in revenue. TSMC shipments of 3nm ...

BOPLA, a specialist developer of electronic enclosures, has introduced BoVersa, a new enclosure concept that’s been designed ...

Sources said Samsung plans to deploy the new machines at its 2 nm foundry lines, which already produce Exynos 2600 ...

Molex, the global electronics connectivity company, has announced that it has signed an agreement to acquire Smiths ...

Ceva has announced it is the first IP vendor to achieve Bluetooth 6.0 qualification with Channel Sounding support.