At OFC 2025, imec unveiled a proof of concept for a photonics-based CDM FMCW 144-GHz distributed radar system, which could ...

Hybrid circuit protection devices, using a combination of technologies, provide better protection for industrial Ethernet ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

Littelfuse’s IXD2012NTR high-side and low-side gate driver drives two N-channel MOSFETs or IGBTs in a half-bridge ...

Microchip’s highly integrated MCPF1412 power module saves space and delivers flexible configuration and monitoring.

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

Allegro’s CT4022/32 TMR current sensors claim ultra-low noise and high-precision current measurements for clean energy ...