New regulations make this non-negotiable, but multi-die assemblies and more interactions at the edge are creating some huge ...

Tariffs, EV costs and challenges, and fundamental architectural and technology improvements add up to transformative ...

Edge devices across multiple applications share common attack vectors. Security functionality must be designed in from the ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Safety mechanisms designed to handle rare events can become unreliable under sustained or intense fault conditions.

A new technical paper titled “Enabling Physical AI at the Edge: Hardware-Accelerated Recovery of System Dynamics” was ...

A new technical paper titled “A Cryogenic Ultra-Thin Body SiGeSn Transistor” was published by researchers at TU Wien, ...

Synopsys has introduced its HPC multi-channel MACsec Security Modules, engineered to efficiently support high data rates, ranging from 200Gbps to 1.6Tbps, with built-in scalability to reach ...

A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

How to mitigate common errors that expose devices to security threats.

Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory ...