After the Shanghai Tong'er technical team assisted in correcting the files by adding pad tolerance markings (±0.02mm) and optimizing the opening design, the defect rate was reduced to 0.8%. The PCB ...

People are increasingly turning to software to design complex material structures like airplane wings and medical implants. But as design models become more capable, our fabrication techniques haven't ...

Emerging chiplet, memory, and interconnect technologies demand layered, automated solutions to deliver predictable ...

The partnership between X-FAB and Thalia aims to preserve the integrity of design transitions from one process node to ...

MEMS advances are set to transform the future of sensors, according to Dr Josep Montanyà i Silvestre, CEO at Nanusens.

For most gamers, a keyboard is just a keyboard—a tool you plug in and use. But what if it could be an extension of your hands ...

Blueshift, a US-based specialist in advanced materials, has unveiled PhaseBlue 1500, the first product in its Series Circuit ...

By teaching AI to read datasheets with human-level accuracy, Zenode accelerates part selection—the foundation of every printed circuit board ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...