Abstract: Die attach and interconnect materials for power module device studied in this experiment included pressure-less sintering paste and SnSb solder. The initial evaluation on various ...
Abstract: Through-glass via (TGV) technology, as one of the key technical paths for three-dimensional integrated packaging, offers advantages such as shorter interconnection distances, superior ...
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Solder Copper Pipe the Right Way Short Tip
Expert DIYer April Wilkerson shows how to solder copper pipe the right way in a quick demo. Trump Overturns Biden Decision on Space Command Orcas attack and sink another boat off the coast of Portugal ...
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