Semiconductor Engineering

Enhancing Test Socket Performance Through Application-Specific Validation And System-Level Per-Pin OQC

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Semiconductor Engineering

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection

This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
EDN

BGA test socket features precise ball-to-pin alignment

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
EDN

SOIC test socket takes the heat

Used for burn-in and testing, Ironwood Electronics’ CBT-SO-4006 stamped spring-pin socket spans a temperature range of −55°C to +180°C. The socket accommodates small-outline ICs that have a body size ...
Electronic Design

October 2020 Tech Focus: Test Sockets Get a Plug

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...