Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

Here is how designers can break functional systems into sub-functional chiplets and use advanced packaging integration ...

Improvements in three-dimensional (3D) scanning have enabled quick and accurate scanning of 3D objects, including cultural heritage objects, as 3D point cloud data. However, conventional ...

EDGE Group, the UAE-based defence conglomerate, has partnered with innovation platform Wazoku to launch a global challenge aimed at discovering the next generation of autonomous drone systems. The ...