IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...
Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...
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NEOTech Announces Implementation of Enhanced Wire Bonding Process to Boost Microelectronics Manufacturing Efficiency
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...
A new technical paper titled “A Comparative Study on Various Au Wire Rinse Compositions and Their Effects on the Electronic Flame-Off Errors of Wire-Bonding Semiconductor Package” was published by ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...
A research team led by German research center Forschungszentrum Jülich GmbH has proposed to use direct wire bonding (DWB) as a low-temperature method for interconnecting finger-free heterojunction ...
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