The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

Muhlbauer, a leading global producer of machinery for the manufacture of smart cards and ID solutions, released a new die sorter for flip chip manufacturing environments. Called the DS 15000, it is ...

Wafer sorting is usually regarded as the most critical stage in the whole wafer probing process. This paper discusses the wafer sorting scheduling problem (WSSP) with total setup time minimization as ...