A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...

Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...

Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.

SAN MATEO, Calif. Ziptronix, a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.) will introduce a new “engineered substrate” material Tuesday (Sept. 9) for use in ...

Fracture and breakage of single crystals, particularly of silicon wafers, are multi-scale problems: the crack tip starts propagating on an atomic scale with the breaking of chemical bonds, forms crack ...

The two companies say they are cooperating on the development of low temperature wafer bonding equipment and process technologies. Silicon Genesis Corp. (SiGen) and EV Group (EVG) said today they are ...

ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/b0de27/thin_wafer_manufac) has announced the addition of the "Thin Wafer ...