A process that places bare chips onto a printed circuit board (PCB) by first attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the ...
A bare chip that is mounted directly onto the printed circuit board (PCB). After the wires are attached, a glob of epoxy or plastic is used to cover the chip and its connections. The tape automated ...
A proprietary remote adhesive tape feed unit mounted on a robot or cobot is designed to handle repetitive, demanding and strenuous tape applications. The RoboTape System for 3M Tape includes a payout ...
Tokyo, Japan — Advantest Corp. has introduced the M7522 dynamic test handler, which offers the industry's highest processing speed and positioning accuracy for fine-pitch tape automated bonding (TAB) ...
Splicing tapes—engineered for joining materials during manufacturing without disrupting operations—continue to gain relevance ...
Equipment specifications include placement of thin to standard ply thickness tape (up to 1 inch width), laser and IR heating with in-situ temperature control and thermal camera feedback, and ...
At the productronica trade fair in Munich this November, the Fraunhofer Institute for Laser Technology ILT will be presenting Laser-Based Tape-Automated Bonding, LaserTAB for short. The experts from ...
At its June 12 shareholders meeting, Fupo Electronics decided not to issue a dividend this year. Despite losing an accumulated NT$200 million through the end of 2000, the Taiwan-based TAB (tape ...
Advanced Semiconductor Engineering (ASE) today announced that it has developed two chip manufacturing technologies, dubbed Tape Carrier Package (TCP) and High Lead Bumping, both of which are already ...
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