Non-volatile memory for weight storage on-chip reduces data movements and allows for low power, low latency edge AI inferencing in high radiation environments ...
New X-HBM architecture delivers a 32K-bit wide data bus and potentially 512 Gbit per die density, offering 16X more bandwidth or 10X higher density than traditional HBM "X-HBM is not an incremental ...
The spotlight is on two-dimensional materials in response to the demands of the artificial intelligence (AI) era, which necessitates high computing power, low energy consumption, and compact ...
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...
At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...
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