[Left] The schematic shows the multi-functions of the 2D-WS2 bottom interfacial layer for interface stability and the vertically well-ordered domain structures of HZO, which leads to excellent ...

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems ...

The types of devices being deployed in cars and how they differ in functionality. Why each device type requires a different test technique. Determining the best approach for the specific application.

Neuromorphic computing system technology mimicking the human brain has emerged and overcome the limitation of excessive power consumption regarding the existing von Neumann computing method. A ...

A device smaller than a grain of dust is emerging as a surprisingly powerful candidate to reshape how quantum computers are ...

Virtually anything electronic has at least one semiconductor chip inside it and likely many more. From smartphones to automobiles and myriad other products and systems, the tiny devices are the ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

The nRF54LM20B SoC pairs the Axon NPU with 2 MB NVM, 512 KB RAM, a 128 MHz Arm Cortex-M33 plus RISC-V coprocessor, high-speed ...

Semiconductor aging refers to the slow loss of electrical characteristics of the semiconductor device as a result of continuous use or prolonged exposure to various environmental conditions like ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...