TE Connectivity (TE), formerly Tyco Electronics, has developed a surface-mount LGA 2011 socket specifically for Intel Corp's Core i7 and Xeon 5 CPU processors. The contacts of TE's new LGA 2011 socket ...
Eurocircuits, a European producer of small batch PCBs, has teamed up with Elsyca, a Belgian research company specialising in advanced electrochemical modelling, to implement PCB plating using Elsyca’s ...
Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...
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