Trigence Semiconductor has launched the first audio IC module (ICM) based on TDK’s semiconductor embedded substrate (SESUB) packaging technology. It’s an all-in-one audio output solution for ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...

1. The BM83 from Microchip Technology is a complete Bluetooth RF module that incorporates the company’s IS2083BM high-functionality audio IC. With its diminutive 5.5- × 5.5-mm BGA package, the ...

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics (FGEL), marking a ...

Gigabit line cards are being tasked with accommodating a plethora of physical-layer transceivers, ranging from octal-type Fast Ethernet versions to copper- and fiber-based Gigabit Ethernet ...

Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather than modules made ...

As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...