Advancements in design processes are said to be responsible for the 236 series terminal blocks' ability to adapt to the solder reflow process. In particular, the series employs an optimized pin length ...

Designed for high-density packaging on 0.062- and 0.093-in.-thick PCBs, a line of ruggedized press-in type PTFE-insulated terminals suits high-temperature precision applications. The terminals resist ...

Engineers invent 'green' method that combines quantum mechanics with machine learning to accurately predict oxide reactions at high temperatures when no experimental data is available; could be used ...

From the last several lithography nodes, in the 14 to 10nm range, to the latest nodes, in the 7 to 5nm range, the requirements for patterning and image transfer materials have increased dramatically.

The performance of the final product depends heavily on the degree of cure - making it critical to ensure that the reaction goes to completion for the highest quality and reliability. Achieving this ...

IN comparing workshop processes at present in use with those employed twenty years ago, many striking changes may be noted, all tending to cheaper and more rapid production. It will be found, on ...

Temperature is the most widely measured variable in the process industries, and it is often a critical factor in industrial processing. If a temperature measurement is not accurate or reliable, it can ...